The arrangement and method for sputtering material onto a workpiece and
cleaning a target of the sputtering chamber includes exposing a target to
an electromagnetic field of a strength sufficient to remove particles
from the target. The electromagnetic field is generated by an
electromagnetic device that is positioned in proximity to the target and
generates a strength greater than a strength of a cathode magnetic field
behind the target to safely remove the contaminating particulates from
the target, which may be made of a strong magnetic material.