A load floor (22) for a motor vehicle (20) has a foamed substrate layer (34) having a peripheral edge (42) and a facing layer (32), formed from hardboard or other sheet material. An adhesive layer (36) adheres the substrate layer (34) to the facing layer (32). Grooves (68, 70) are formed on a top surface (40) of the substrate layer (34) and extend to the peripheral edge (42) to provide an egress for fluids at the peripheral edge (42) during curing of the adhesive layer (36). The grooves (68, 70) are curved to prevent cracking of the substrate layer (34) under an applied load (74).

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> Method for manufacturing group-III nitride compound semiconductor, and group-III nitride compound semiconductor device

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