Radio frequency (RF) connectors and electronics housings and packages
employing one or more inventive RF connector(s) provided herein utilize a
ground spring to achieve improved conductivity of the ground signal by
making a plurality of contacts with a ferrule member of the RF
connector's hermetic feedthru and a plurality of contacts with the
electronics housing or package at points adjacent to an air dielectric.
Ground springs used in connection with the present RF connectors maintain
predetermined spring properties under compression and/or extreme
environmental conditions, including thermal fluctuations, and therefore
may be suitably employed in aircraft and spacecraft.