A wired circuit board is provided having enhanced reliability of
electrical connection between a metal substrate and a shield layer to
achieve significant noise reduction reliably. An insulating base layer is
formed on the metal substrate, while resin layers are formed on the metal
substrate with a predetermined space provided from the both widthwise
sides of the insulating base layer. A conductor layer is formed having a
predetermined wired circuit pattern on the insulating base layer.
Thereafter, an insulating cover layer is formed on the insulating base
layer in such a manner as to cover the conductor layer. Then, a shield
layer is laminated on the metal substrate to cover the insulating cover
layer and also is put in close contact with the resin layers at end
portions thereof by a vacuum film-forming method or by plating.